Hang Shun Chip

       In 2006, Hangshun Microelectronics Co., Ltd. was established in Shanghai. In the early stage, it mainly developed and sold LDO, EEPROM, SPI NOR Flash, lithium battery charging management, LCD driver and other general devices.

       In 2013, Hangshun moved to Shenzhen and established Hangshun Chip Co., Ltd.

       In 2015, it began to design a 32-bit general-purpose MCU with ARM 32-bit Cortex M0/M3 core. Design team mainly includes former Fujitsu design team in Japan, and was established as a research and development center in Chengdu.
       M3 series products are the first-generation products, which were supplied in batches starting in 2017.

       M0 series products are the second batch of Hangshun products, which were supplied in batches starting in 2018.
       November 2017, as the eight key importing enterprises of Longhua, Shenzhen, it signed a contract to enter Longhua Wisdom Valley.

       It planned IPO coaching in 2019.